Week 6

In this week, my supervisor and I carried out a simulation to find out the causes of broke and crack neck of 1st bond in the unit. We changed a few parameters in the wire bond machine to see the difference. Next, we changed the wire to 2N wire and looked at its difference.

To be able to see the wire's neck, photos need to be taken by using a machine called SEM.

The picture above is a 1st bond of wire in a unit.

Next, I also continue to finish of the One Point Lesson slides on the loop height. Furthermore, I was given a task to create 3 leadframes with 'inkdie' to check on the leadframe's decolouration problem. The operator taught me the basic procedures to operate the Die Attach machine. It was very interesting. After the wire bond process, I was to do a 2nd pull test for the units, 20 data for each leadframe. The pull test was a very hard to perform, the needle will accidentally broken. Therefore need to be caution.