Week 7

As for this week, I took the pictures of the 4N&2N wires in the FA lab using the SEM machines. Next, I was told to run a total of 47 leadframes in order to check the leadframes' decolouration problem. As a result, no problem was detected after performing X-Ray for the wires. But it was very time consuming.

This week, unfortunately, a exposed pad case was detected, but only 1 unit in the whole lot. Therefore, I keyed in information into the time mapping summary. Micron's team, our new company boss visited our site this week, our company gave them a warm welcome to Muar.
The team gave all the staff a briefing session about Micron.

I was assigned to find out what is ball shear, ball height, loop height, die shear and also pull test. There is a spec parameter for each of the category. Besides that, I also helped to keyed in the Statical Process Control (SPC) data into the Datalyzer spectrum database. The purpose of the data was to monitor the quality of the product by looking at the graph presented by the keyed in data. The QA department staff will make improvement base on the SPC graph. There was Upper & Lower limit for the SPC value, if it was to exceed the limit, actions must be taken to solve the problems.

Week 6

In this week, my supervisor and I carried out a simulation to find out the causes of broke and crack neck of 1st bond in the unit. We changed a few parameters in the wire bond machine to see the difference. Next, we changed the wire to 2N wire and looked at its difference.

To be able to see the wire's neck, photos need to be taken by using a machine called SEM.

The picture above is a 1st bond of wire in a unit.

Next, I also continue to finish of the One Point Lesson slides on the loop height. Furthermore, I was given a task to create 3 leadframes with 'inkdie' to check on the leadframe's decolouration problem. The operator taught me the basic procedures to operate the Die Attach machine. It was very interesting. After the wire bond process, I was to do a 2nd pull test for the units, 20 data for each leadframe. The pull test was a very hard to perform, the needle will accidentally broken. Therefore need to be caution.

5th Week

As for this week, I helped to complete some One Point Lesson slides for audit. The OPL were on procedures and precautions methods. I took pictures of the procedures with the help of technicians and operators. Then, I typed it into a specific format before printing it.

4th Week

This week, I ran a simulation on WB handling process to see whether this could cause exposed pad, but the result is negative. I also went to Final Analysis Lab to do cross section for the unit. From the cross section, the tilted leadframe could be measured. Next, I also did a 2nd simulation on the WB handling process, It did caused some minor exposed pad, I recorded all these into the summary.