Sunday, April 18, 2010

2nd Week

Week 2:

This is the second week of industrial training in Numonyx. This week, I was given an assignment by my supervisor. The task is to find out the causes of ‘Exposed Pad’ of the devices. Each device will go through mold process but some minor amount of device will have the problem of exposing its leadframe at the bottom of the device. This is a critical threat, if one of this device escape to the customers, the company will surely suffer its consequences.
Basically, there are many factors that can cause ‘Exposed Pad’. The causes are such as material quality, machine problems, human carelessness, handling and many more. A ‘4M’ & ‘4w 1H’ method is used to analyse the problem. ‘4M’ is Material, Man, Machine and Method. ‘4w 1H’ is who, what, where, when and how. So, I was given some data on exposed pad cases and to summarize and sort them.
Actually, ‘Exposed Pad’ is manily caused by the downset of the leadframe. Downset is caused by the bending of degate. Due to this problem, it will cause ‘exposed pad ‘ in the molding process.
Besides that, I also need to monitor all the machines involved in ‘Exposed Pad’ in order to find out the tendacy of causing leadframe downset. The machines are such as DA, WB, Molding machines. These three processes will have a higher chances for leadframe downset to happen because each process involved transporting.

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